DocumentCode
2434940
Title
Nonlinear vibration analysis of ultrasonic horn model for flip-chip bonding
Author
Lee, Sao Il ; Hong, Sang Hyuk
Author_Institution
Univ. of Seoul, Seoul
fYear
2007
fDate
17-20 Oct. 2007
Firstpage
2804
Lastpage
2807
Abstract
A simple model has been developed and analyzed capturing the main dynamic features in longitudinal flip-chip bonding. The ultrasonic horn is modeled as a longitudinal rod with the contact conditions after verifying the modal characteristics by using finite element analysis. The MATLAB simulation is performed for the simplified equation of motion of the horn model and the results show the nonlinear vibration effects in the flip-chip bonding process.
Keywords
finite element analysis; flip-chip devices; ultrasonic bonding; vibrations; MATLAB simulation; finite element analysis; lead-free bonding; longitudinal flip-chip bonding; longitudinal rod; modal characteristics; nonlinear vibration analysis; ultrasonic horn model; Aerodynamics; Bonding processes; Electronic mail; Finite element methods; Frequency; MATLAB; Mathematical model; Nonlinear equations; Shape; Vibrations; Flip-chip bonding; Nonlinear analysis; Ultrasonic horn;
fLanguage
English
Publisher
ieee
Conference_Titel
Control, Automation and Systems, 2007. ICCAS '07. International Conference on
Conference_Location
Seoul
Print_ISBN
978-89-950038-6-2
Electronic_ISBN
978-89-950038-6-2
Type
conf
DOI
10.1109/ICCAS.2007.4406846
Filename
4406846
Link To Document