Two basic approaches towards adhesive nanowire-filled films for anisotropic nanowiring

We present two different strategies for the future concept of vertical interconnection involving a highly resolved nanoscale wiring. The basic concept involves the lamination of a thin film with parallely oriented metallic nanowires (NWs) embedded inside a dielectric matrix. When it comes to this matrix, basically two different materials can be considered nowadays to serve once as the templating matrix while NW growth as well as the carrying film material for later application by lamination. The latter thereby strongly influences the contact properties of the NWs to the contact pad whilst the first directs growth and geometric properties of the NWs strongly. The materials compared in this paper are namely anodically oxidized alumina (AAO) and track-etched poly carbonate (PC). A comparison is made based once on structural investigations of Ag-filled membranes as well as on investigations to make the NW films adhesive to surfaces.