Title :
A TSV last integration approach with wafer level pre-patterned adhesive bonding
Author :
Zhu, Yunhui ; Ma, Shenglin ; Sun, Xin ; Cui, Qinghu ; Zhong, Xiao ; Bian, Yuan ; Chen, Jing ; Miao, Min ; Jin, Yufeng
Author_Institution :
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, 100871, China
Abstract :
In this paper, a TSV last wafer level 3D integration scheme using pre-patterned benzocyclobutene (BCB) adhesive bonding was proposed. With pre-patterned BCB adhesive bonding, a one-time bottom-up TSV filling features as the last step, which eliminates the traditional solder bumping and underfill filling. Preliminary results show that this process is promising for integration of similar chips such as memory chips.
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2012 4th
Conference_Location :
Amsterdam, Netherlands
Print_ISBN :
978-1-4673-4645-0
DOI :
10.1109/ESTC.2012.6542115
