• DocumentCode
    2435952
  • Title

    Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions

  • Author

    Nagl, B. ; Czerny, B. ; Lederer, M. ; Khatibi, G. ; Thoben, M. ; Nicolics, J.

  • Author_Institution
    Siemens AG, Cumberlandstrasse 32-34, A-1140 Vienna, Austria
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper discusses different application relevant electrical loading cases of an IGBT module of a power inverter. Thereby, different operation conditions such as pulse frequencies, inverter output currents and output frequencies, as well as two different operation modes are discussed. Each load case investigation is conducted by electrical, thermal, and in situ vibration measurements. Moreover, on the base of finite element analyses a deeper insight is gained into reliability relevant thermo-mechanical behavior. For this purpose an IGBT module is operated at a load of 30% to 80% of its nominal value in order to cause representative thermo-mechanical displacements of dies and bond wires. By applying an inverter output frequency in a range of 1 to 280 Hz a temperature ripple of up to 40 K on the dies and a vertical displacement of up to 9 μm on a bond wire is observed. These results are important to improve life-time-predictions.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542120
  • Filename
    6542120