• DocumentCode
    2436261
  • Title

    Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

  • Author

    Ng, Jack Hoy-Gig ; Ssekitoleko, Robert T. ; Nguyen, Hoang-Vu ; Aasmundtveit, Knut E. ; Demore, Christine E.M. ; Cochran, Sandy ; Desmulliez, Marc P.Y.

  • Author_Institution
    MIcroSystems Engineering Centre (MISEC), Institute of Sensors, Signals and Systems (ISSS), Heriot-Watt University, Edinburgh EH14 4AS, Scotland, UK
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542139
  • Filename
    6542139
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2436261