Low temperature joining technique (LTJT) as an alternative to lead-free soldering for die-attach applications

A group of silver, thick-film, screen printable and lead-free pastes varying in composition, with different grain size distribution of used Ag powders, has been elaborated and tested. They are designed to be sintered between 300 and 400°C. The technology of preparing these pastes is discussed. The application of the elaborated materials in die-attachment is demonstrated. Shear strengths ∼20 N/mm² were achieved.