In-plane pigtailing of silicon photonics device using “semi-passive” strategies

In this paper, we present two innovative solutions for the packaging of silicon photonics devices based on “semi-passive” alignment strategies using etched silicon microparts as ferrule holder. The goal is to reach lower manufacturing cost, compact devices for future multichannel optical interconnections, with high manufacturing throughputs compared to legacy technologies (e.g. active alignment). These approaches address either edge (planar) coupling or vertical coupling. In the case of edge emitters inverted tapers, we used lensed fibers beforehand attached to a silicon v-groove, so that the working distance of the lens is controlled before lateral/longitudinal alignment. It allows reliable attachment of the fiber to the chip to be achieved. In the case of Vertical Grating Coupler, we have developed multichannel silicon v-groove fiber holders, including a gold deposited mirror to redirect the light emitted from the Grating Coupler in-plane. The assembly process is achieved in two steps, using microelectronic standard flip-chip machine and pure passive pigtailing. The measured performances are promising in both configurations, as a result these two packaging platforms can be considered as smart solutions for emerging markets, when low profile dimensions and low manufacturing costs are mandatory.