• DocumentCode
    2437001
  • Title

    Process characterization of thin wafer debonding with thermoplastic materials

  • Author

    Phommahaxay, Alain ; Jourdain, Anne ; Verbinnen, Greet ; Woitke, Tobias ; Stieber, Ralf ; Bisson, Peter ; Gabriel, Markus ; Spiess, Walter ; Guerrero, Alice ; McCutcheon, Jeremy ; Puligadda, Rama ; Bex, Pieter ; Van den Eede, Axel ; Swinnen, Bart ; Beyer,

  • Author_Institution
    imec, Kapeldreef 75, 3001 Leuven, Belgium
  • fYear
    2012
  • fDate
    17-20 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in device processing over the past years. While these elements are now mature enough for high-volume manufacturing, thin wafer debonding and handling still remain challenging. Hence this work focuses on extensive characterization of a thermal debonding approach to answer these challenges.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2012 4th
  • Conference_Location
    Amsterdam, Netherlands
  • Print_ISBN
    978-1-4673-4645-0
  • Type

    conf

  • DOI
    10.1109/ESTC.2012.6542176
  • Filename
    6542176
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2437001