DocumentCode :
2437654
Title :
Material aspects of high power microwave windows
Author :
Parshin, Vladimir V. ; Vikharev, Anatoly L. ; Heidinger, Roland ; Meier, Andreas ; Scherer, Theo ; Garin, Boris M. ; Dutta, Jyotsna M.
Author_Institution :
Inst. of Appl. Phys., Russian Acad. of Sci., Nizhny Novgorod
fYear :
2008
fDate :
15-19 June 2008
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. The candidate materials for high power mm-wave window materials like sapphire, boron nitride, high-resistivity silicon, CVD-diamond and silicon carbide will be presented and the production technology briefly described. The material parameters will be discussed which are most relevant for high power operation. Experimental data of absorption values in selected grades of window materials will be reported resulting from measurements at frequencies from 40 GHz up to 380 GHz and in the temperature interval of 40-900 K. The main absorption mechanisms for ultra-low loss materials will be described and prospects will be given for advancing these materials in the THz region. It will be shown that CVD diamond is the only material currently available with a transmission capability of several Megawatt in CW operation and that CVD Diamond is the primary candidate material for high-power THz applications.
Keywords :
boron compounds; diamond; microwave materials; microwave spectra; sapphire; silicon; silicon compounds; Al2O3; BN; C; CVD-diamond; Si; SiC; absorption mechanisms; boron nitride; frequency 40 GHz to 380 GHz; high power microwave windows; high-power THz applications; high-resistivity silicon; sapphire; silicon carbide; ultralow loss materials; Absorption; Boron; Frequency measurement; Loss measurement; Physics; Power engineering and energy; Production; Silicon carbide; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2008. ICOPS 2008. IEEE 35th International Conference on
Conference_Location :
Karlsruhe
ISSN :
0730-9244
Print_ISBN :
978-1-4244-1929-6
Electronic_ISBN :
0730-9244
Type :
conf
DOI :
10.1109/PLASMA.2008.4590796
Filename :
4590796
Link To Document :
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