Title :
RadHard 16Mbit SRAM Packaged in a Cantilever Die Multi-Chip Module
Author :
Hafer, Craig ; Mabra, Jonathan ; Slocum, Duane ; Thorne, Sean
Author_Institution :
Aeroflex, Colorado Springs
Abstract :
Aeroflex Colorado Springs has developed a 16 Mbit multi-chip module (MCM) SRAM operating on a single 5 V power supply. Using a cantilever die stacking approach, two die are stacked on the top side of the package and two die are stacked on the bottom side of the package for a minimum foot print configuration. Conventional aluminum wire bonding has been used to optimize the reliability of this packaging technique.
Keywords :
SRAM chips; integrated circuit packaging; multichip modules; radiation hardening (electronics); Aeroflex Colorado Springs; MCM; RadHard 16Mbit SRAM; aluminum wire bonding; cantilever die multichip module; cantilever die stacking; packaging technique; radiation hardened SRAM; storage capacity 16 Mbit; voltage 5 V; Aluminum; Assembly; Bonding; Packaging; Plasma applications; Power supplies; Random access memory; Springs; Stacking; Wire;
Conference_Titel :
Aerospace Conference, 2007 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
1-4244-0524-6
Electronic_ISBN :
1095-323X
DOI :
10.1109/AERO.2007.353101
