DocumentCode
2437929
Title
Multi-Functional Spacecraft Structures Integrating Electrical and Mechanical Functions
Author
Schatzel, Donald V.
Author_Institution
Jet Propulsion Lab., Pasadena
fYear
2007
fDate
3-10 March 2007
Firstpage
1
Lastpage
6
Abstract
Future earth orbiting, solar system and celestial body autonomous missions can benefit from spacecraft systems and instruments that have significantly lower weight and volume over current state of the art designs. Incorporating electronic traces or signal paths directly into the spacecraft or instrument structure can provide a significant savings in weight and volume. In addition, local computer processing power, increased operational speed and larger memory storage are achievable by using embedded or direct chip attach design methods. The objective of this technology development is to demonstrate the feasibility of electronic circuit boards that function as structural members within a subsystem. This dual functionality will be achieved by utilizing printed circuit board materials that demonstrate structural properties of strength and stiffness that can compete with current spacecraft structural applications that require the use of aluminum and titanium.
Keywords
aerospace components; aerospace materials; mechanical testing; printed circuits; space vehicles; celestial body autonomous missions; direct chip attach design; earth orbiting mission; electrical/mechanical functions integration; multifunctional spacecraft structures; printed circuit boards; solar system missions; spacecraft instruments; state of the art designs; Aerospace electronics; Design methodology; Earth; Electronic circuits; Embedded computing; Instruments; Printed circuits; Solar system; Space technology; Space vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2007 IEEE
Conference_Location
Big Sky, MT
ISSN
1095-323X
Print_ISBN
1-4244-0524-6
Electronic_ISBN
1095-323X
Type
conf
DOI
10.1109/AERO.2007.352644
Filename
4161522
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