Title : 
Irregularly shaped voltage islands generation with hazard and heal strategy
         
        
            Author : 
Zhen Meng ; Song Chen ; Lu Huang
         
        
            Author_Institution : 
Dept. of Electron. Sci. & Technol., USTC, Hefei, China
         
        
        
        
        
        
            Abstract : 
Irregular Shaped Voltage Islands (ISVI) can achieve much better power savings in multiple supply voltage (MSV) technology. This paper proposes a simulated annealing (SA) based floorplanning method with ISVI generation using a Hazard and Heal strategy. In each perturbation of SA, a randomly chosen block is removed from floorplan and then inserted back to a proper position, to join certain voltage island. The solution space for every iteration is O(n2kvi), where n is block number and kvi is voltage island number. Every position with voltage island assignment is evaluated by a linear combination of chip area, wire length, power and voltage island cost. To avoid timing-consuming evaluation of O(n2kvi) possibilities, we propose a fast Hazard method to construct ISVI by skipping lots of distant voltage island candidates while occasionally accepting seldom-emerged illegal (non-contiguous) candidates. To resolve the seldom-emerged non-contiguous voltage islands, a detailed Heal method is applied in each temperature. Experimental results show the proposed method is effective and efficient compared with the latest works.
         
        
            Keywords : 
circuit layout; simulated annealing; ISVI generation; hazard and heal strategy; irregularly shaped voltage islands generation; multiple supply voltage technology; simulated annealing based floorplanning method; Algorithm design and analysis; Hazards; Linear programming; Merging; Simulated annealing; Wires; Floorplan; Irregular Shaped Voltage Island; Sequence Pair; level shifter;
         
        
        
        
            Conference_Titel : 
Quality Electronic Design (ISQED), 2015 16th International Symposium on
         
        
            Conference_Location : 
Santa Clara, CA
         
        
            Print_ISBN : 
978-1-4799-7580-8
         
        
        
            DOI : 
10.1109/ISQED.2015.7085445