• DocumentCode
    243889
  • Title

    A Low-Cost and High-Performance Embedded System Architecture and an Evaluation Methodology

  • Author

    Xiaokun Yang ; Andrian, Jean H.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Int. Univ., Miami, FL, USA
  • fYear
    2014
  • fDate
    9-11 July 2014
  • Firstpage
    240
  • Lastpage
    243
  • Abstract
    A reduced interface and high performance embedded system architecture (MSBUS) is proposed in this paper. The control bus is low-cost and low-power, whereas the data bus is high-bandwidth and high-speed especially. In addition, a Universal Verification Methodology (UVM)-based performance evaluation methodology is proposed to estimate the hardware structures. In order to evaluate the bus performance, AHB, AXI and MSBUS DMA are implemented as a case study. The experimental results show that MSBUS DMA uses the least hardware resources, reduces energy consumption to a half of AHB and AXI in the block transfer mode, and achieves 3.3 times and 1.6 times valid bandwidth of AHB and AXI respectively. Moreover, the proposed evaluation methodology is effectively used with sufficient accuracy.
  • Keywords
    embedded systems; low-power electronics; parallel architectures; performance evaluation; power aware computing; protocols; system buses; system-on-chip; AHB; AXI; MSBUS DMA; UVM-based performance evaluation methodology; block transfer mode; bus performance evaluation; control bus; energy consumption reduction; hardware structure estimation; high-bandwidth data bus; high-performance embedded system architecture; high-speed data bus; low-cost embedded system architecture; universal verification methodology; Bandwidth; Computer architecture; Hardware; Performance evaluation; Protocols; System-on-chip; Wires; UVM; high bandwidth; high speed; low power; system architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on
  • Conference_Location
    Tampa, FL
  • Print_ISBN
    978-1-4799-3763-9
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2014.20
  • Filename
    6903367