DocumentCode
2438931
Title
Application of fault diagnosis based on signed digraphs and PCA with linear fault boundary
Author
Shin, Bong-Su ; Lee, Chang Jun ; Lee, Gibaek ; Yoon, En Sup
Author_Institution
Seoul Nat. Univ., Seoul
fYear
2007
fDate
17-20 Oct. 2007
Firstpage
984
Lastpage
987
Abstract
In this paper, we developed a fault diagnosis model based on signed digraph(SDG), support vector machine(SVM) and improved principal component analysis(PCA) method. In PCA, we set linear fault boundaries. By means of the system decomposition based on SDG, the local models of each measured variable are constructed and more accurate and fast models are using an SVM, which has no loss of information and shows good performance, in order to obtain the estimated value of the variable, which is then compared with the measured value in order to diagnose the fault. And then, in order to make fault boundaries linearized, we select particular variables in the local model and express the data through the PC space. In the last analysis for various fault intensities, we diagnose a number of faulty data effectively. To verify the performance of the proposed model, the Tennessee Eastman(TE) Process was studied and the proposed method was found to demonstrate a good diagnosis capability compared with previous statistical methods.
Keywords
directed graphs; failure analysis; fault diagnosis; principal component analysis; process monitoring; quality control; support vector machines; Tennessee Eastman process monitoring; fault diagnosis model; principal component analysis; quality control; signed digraph; support vector machine; Biological system modeling; Chemical analysis; Chemical engineering; Electronic mail; Fault diagnosis; Loss measurement; Predictive models; Principal component analysis; Statistical learning; Support vector machines; PCA; fault diagnosis; fault intensity; linear fault boundary; signed digraph; support vector machine;
fLanguage
English
Publisher
ieee
Conference_Titel
Control, Automation and Systems, 2007. ICCAS '07. International Conference on
Conference_Location
Seoul
Print_ISBN
978-89-950038-6-2
Electronic_ISBN
978-89-950038-6-2
Type
conf
DOI
10.1109/ICCAS.2007.4407067
Filename
4407067
Link To Document