DocumentCode :
2439151
Title :
Call to Participate in Second Interlaboratory Electromigration Experiment
Author :
Schafft, Harry A. ; Achée, Ehren T.
fYear :
1994
fDate :
16-19 Oct 1994
Firstpage :
150
Keywords :
Circuit testing; Collaborative software; Electromigration; Laboratories; NIST; Packaging; Software testing; Standards publication; Stress; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Print_ISBN :
0-7803-1908-7
Type :
conf
DOI :
10.1109/IRWS.1994.515850
Filename :
515850
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2439151
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