DocumentCode
2439151
Title
Call to Participate in Second Interlaboratory Electromigration Experiment
Author
Schafft, Harry A. ; Achée, Ehren T.
fYear
1994
fDate
16-19 Oct 1994
Firstpage
150
Keywords
Circuit testing; Collaborative software; Electromigration; Laboratories; NIST; Packaging; Software testing; Standards publication; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1994. Final Report., 1994 International
Print_ISBN
0-7803-1908-7
Type
conf
DOI
10.1109/IRWS.1994.515850
Filename
515850
Link To Document