An Enhanced Prognostic Model for Intermittent Failures in Digital Electronics

Author

Zhang, Guangfan ; Kwan, Chiman ; Xu, Roger ; Vichare, Nikhil ; Pecht, Michael

Author_Institution

Intelligent Autom. Inc., Rockville

fYear

2007

fDate

3-10 March 2007

Firstpage

1

Lastpage

8

Abstract

This paper presents an enhanced prognostic model to predict remaining useful life. The model utilizes environmental loads and in-situ performance measurements in conjunction with two baseline prediction algorithms: life consumption monitoring (LCM) and uncertainty adjusted prognostics (UAP). Fusion techniques are then utilized to integrate the two prognostic algorithms. A key and unique value of this combined prognostic model is its ability to assess intermittent as well as "hard" failures. In the paper we show how it has been validated for intermittent and "hard" solder joint interconnect failures under temperature cycling loads.

Keywords

failure analysis; interconnections; remaining life assessment; solders; baseline prediction algorithms; digital electronics; enhanced prognostic model; environmental loads; fusion techniques; intermittent failures; life consumption monitoring; prognostic algorithms; remaining useful life prediction; solder joint interconnect failures; temperature cycling loads; uncertainty adjusted prognostics; Aerospace electronics; Automation; Condition monitoring; Electrical resistance measurement; Load modeling; Prediction algorithms; Predictive models; Prognostics and health management; Soldering; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2007 IEEE

Conference_Location

Big Sky, MT

ISSN

1095-323X

Print_ISBN

1-4244-0524-6

Electronic_ISBN

1095-323X

Type

conf

DOI

10.1109/AERO.2007.352884

Filename

4161661