Assembly techniques related to die crack in high power dissipation MDIPs

This study focuses on the assembly process variables that can have an impact on die cracking in high-power-dissipation molded dual in-line packages (MDIPs). The wafer saw and die attach processes are addressed. Wafer saw conditions are examined as they relate to kerf and the ability of edge-chipping to propagate fracture. Transducer measurements are made using commercially available die attach equipment to determine the force being exerted on the die during processing. Various equipment setups are reported on in an effort to eliminate topside and backside silicon damage which can result in die cracking.<>