DocumentCode :
2440806
Title :
Modeling on rapid ablation/sublimation from the surface of solid particles injected into thermal plasmas
Author :
Tanaka, Y. ; Mostaghimi, J.
Author_Institution :
Div. of Electr. Eng. & Comput. Sci., Kanazawa Univ., Kanazawa
fYear :
2008
fDate :
15-19 June 2008
Firstpage :
1
Lastpage :
1
Abstract :
Summay form only give. Thermal plasmas are often used in materials processing technologies, e.g., plasma spray, powder spheroidization, etc. The raw materials are normally injected into the plasma in the form of powders, which are then accelerated, heated, melted and evaporated. Evaporation/sublimation affects the interaction between the materials and thermal plasmas. Furthermore, evaporation/sublimation modifies the gas flow and temperature fields around the surface of the particles. To understand these complex phenomena, it is of great importance to model the interactions including phase transition, between solid, gas and plasmas in a self- consistent manner. In this work, we have developed a computational model to study the evaporation/ablation of graphite particles immersed in a thermal plasma. Carbon particle sublimation injected into thermal plasmas was simulated using the CIP-CUP method, which is a unified solver for incompressible and compressible flows including different phases of matter. In addition, the volume of fluid (VOF) function was adopted to track the boundary between solid and gas. The gas flow and temperature fields were obtained during the sublimation.
Keywords :
carbon; evaporation; graphite; plasma materials processing; spheroidizing; sublimation; carbon particle sublimation; evaporation; gas flow; graphite particles; plasma materials processing; plasma spray; plasma-material interaction; powder spheroidization; rapid ablation; rapid sublimation; solid particles; temperature field; thermal plasmas; volume of fluid function; Computational modeling; Fluid flow; Plasma accelerators; Plasma materials processing; Plasma simulation; Plasma temperature; Powders; Rapid thermal processing; Solid modeling; Thermal spraying;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2008. ICOPS 2008. IEEE 35th International Conference on
Conference_Location :
Karlsruhe
ISSN :
0730-9244
Print_ISBN :
978-1-4244-1929-6
Electronic_ISBN :
0730-9244
Type :
conf
DOI :
10.1109/PLASMA.2008.4590971
Filename :
4590971
Link To Document :
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