Title :
Technology aspects of a CMOS neuro-sensor: back end process and packaging
Author :
Hofmann, Franz ; Eversmann, Bjöm ; Jenkner, Martin ; Frey, Alexander ; Merz, Matthias ; Birkenmaier, Tamara ; Fromherz, Peter ; Schreiter, Matthias ; Gabl, Reinhard ; Plehnert, Kurt ; Steinhauser, Michael ; Eckstein, Gerald ; Thewes, Roland
Author_Institution :
Corporate Res., Infincon Technol., Munich, Germany
Abstract :
A CMOS-compatible process is presented which allows to realize sensor arrays for non-invasive, extracellular, high density, long term recording of neural activity. A high-permittivity biocompatible dielectric is used to capacitively couple nerve cell-induced biological signals to the CMOS circuitry-based electronic world. The transducer consists of a multi layer of TiO/sub 2/ and ZrO/sub 2/ and is fabricated in the backend of a 0.5 /spl mu/m standard CMOS technology. Living cells are cultured within a specific package on top of the sensor chip. First measurements reveal proper operation of the chip.
Keywords :
CMOS integrated circuits; bioelectric potentials; biomedical electrodes; biomedical electronics; ceramic packaging; equivalent circuits; integrated circuit packaging; leakage currents; CMOS neuro-sensor; CMOS-compatible process; action potentials; back end process; ceramic package; equivalent circuit; extracellular long term recording; high-permittivity biocompatible dielectric; integrated CMOS circuit; leakage current; nerve cell-induced biological signals; neural activity; noninvasive recording; packaging; passivated electrodes; sensor arrays; Biosensors; CMOS process; CMOS technology; Cells (biology); Coupling circuits; Dielectrics; Electronics packaging; Extracellular; Sensor arrays; Transducers;
Conference_Titel :
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7999-3
DOI :
10.1109/ESSDERC.2003.1256837
