Title :
Reduction of QBD failures in a 0.5 μm BiCMOS process by reducing DC bias
Author_Institution :
Sector of Semicond. Products, Motorola, South Queensferry, UK
Abstract :
Previously a non-classical failure mode was proposed for causing Qbd failure in a 0.5 μm BiCmos process. Machine parameters were used to minimise the failure rate. This provided protection against variations in machine performance which caused medium level fails (<50%) on a GOI monitor flow and product. However a new mechanism became apparent on one system which started to produce 100% failing monitors. This indicated a catastrophic breakdown within the chamber hardware, solutions were focused on two areas, firstly a root cause within the chamber hardware and secondly, the subject of this paper, process optimisation
Keywords :
BiCMOS integrated circuits; surface treatment; 0.5 μm BiCMOS process; GOI monitor flow; QBD failures reduction; chamber hardware; failure rate minimisation; reducing DC bias; BiCMOS integrated circuits; Condition monitoring; Design for quality; Etching; Performance analysis; Radio frequency; US Department of Energy;
Conference_Titel :
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-9651577-4-1
DOI :
10.1109/PPID.2000.870597