• DocumentCode
    2441525
  • Title

    Reduction of QBD failures in a 0.5 μm BiCMOS process by reducing DC bias

  • Author

    Macphie, Alex

  • Author_Institution
    Sector of Semicond. Products, Motorola, South Queensferry, UK
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    Previously a non-classical failure mode was proposed for causing Qbd failure in a 0.5 μm BiCmos process. Machine parameters were used to minimise the failure rate. This provided protection against variations in machine performance which caused medium level fails (<50%) on a GOI monitor flow and product. However a new mechanism became apparent on one system which started to produce 100% failing monitors. This indicated a catastrophic breakdown within the chamber hardware, solutions were focused on two areas, firstly a root cause within the chamber hardware and secondly, the subject of this paper, process optimisation
  • Keywords
    BiCMOS integrated circuits; surface treatment; 0.5 μm BiCMOS process; GOI monitor flow; QBD failures reduction; chamber hardware; failure rate minimisation; reducing DC bias; BiCMOS integrated circuits; Condition monitoring; Design for quality; Etching; Performance analysis; Radio frequency; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 2000 5th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-9651577-4-1
  • Type

    conf

  • DOI
    10.1109/PPID.2000.870597
  • Filename
    870597