DocumentCode :
2441848
Title :
Performance evaluation of silicon carbide devices in power converters
Author :
Shenai, Krishna ; Neudeck, Philip G.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
37
Abstract :
Commercial silicon carbide (SiC) Schottky and PIN diodes, and JFETs were characterized for static conduction and dynamic switching performances in hard- and soft-switching buck converters. The results are compared with the measured data obtained from similarly rated silicon and GaAs devices. It is shown that for low-voltage rectifiers the only real advantage of SiC over silicon and GaAs is the potential for high-temperature operation. A significant improvement in reverse recovery performance was measured for high-voltage SiC PIN diodes compared to silicon PIN diodes. Low-voltage SiC JFETs were found to perform poorly in power converters compared to similarly rated silicon power MOSFETs. It is shown that further technology optimization could make SiC JFETs attractive candidates for high-power high-temperature high-frequency electronics switching
Keywords :
DC-DC power convertors; Schottky diodes; junction gate field effect transistors; p-i-n diodes; semiconductor materials; silicon compounds; switching circuits; JFET; PIN diodes; SiC; dynamic switching performances; hard-switching buck converters; high-power high-temperature high-frequency electronics switching; high-temperature operation; high-voltage SiC PIN diodes; low-voltage SiC JFET; low-voltage rectifiers; performance evaluation; power converters; reverse recovery performance; silicon carbide devices; soft-switching buck converters; static conduction; Aerodynamics; Extraterrestrial measurements; Gallium arsenide; Power electronics; Power semiconductor switches; Rectifiers; Silicon carbide; Switching converters; Vehicle dynamics; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference and Exhibit, 2000. (IECEC) 35th Intersociety
Conference_Location :
Las Vegas, NV
Print_ISBN :
1-56347-375-5
Type :
conf
DOI :
10.1109/IECEC.2000.870622
Filename :
870622
Link To Document :
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