DocumentCode
2442202
Title
Control of wafer charging during ion implantation: Issues, monitors and models
Author
Current, Michael I. ; Lukaszek, Wes ; Vella, Michael C.
Author_Institution
Silicon Genesis Corp., Campbell, CA, USA
fYear
2000
fDate
2000
Firstpage
137
Lastpage
140
Abstract
Charge control during ion implantation depends on the interaction of the ion beam plasma with the device wafer and other local sources of charged species. The key role of the net ion density, plasma electron temperature and plasma ion mass are discussed. The value of local monitoring of the current-voltage characteristics of the net plasma at the wafer surface with EEPROM sense and measurement devices is illustrated with effects of various charge control systems and the influence of resist patterning on the net current flow to the wafer. The special challenges of space charge control for sub-keV ion beams and the impact on local doping uniformity are also discussed
Keywords
EPROM; electric sensing devices; ion implantation; plasma density; plasma materials processing; plasma temperature; semiconductor doping; EEPROM; charge control; current-voltage characteristics; ion implantation; local doping uniformity; measurement devices; net ion density; plasma electron temperature; plasma ion mass; resist patterning; sensing devices; space charge; sub-keV ion beams; wafer charging; Electrons; Ion beams; Ion implantation; Plasma density; Plasma devices; Plasma immersion ion implantation; Plasma measurements; Plasma properties; Plasma sources; Plasma temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location
Santa Clara, CA
Print_ISBN
0-9651577-4-1
Type
conf
DOI
10.1109/PPID.2000.870642
Filename
870642
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