• DocumentCode
    2442202
  • Title

    Control of wafer charging during ion implantation: Issues, monitors and models

  • Author

    Current, Michael I. ; Lukaszek, Wes ; Vella, Michael C.

  • Author_Institution
    Silicon Genesis Corp., Campbell, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    137
  • Lastpage
    140
  • Abstract
    Charge control during ion implantation depends on the interaction of the ion beam plasma with the device wafer and other local sources of charged species. The key role of the net ion density, plasma electron temperature and plasma ion mass are discussed. The value of local monitoring of the current-voltage characteristics of the net plasma at the wafer surface with EEPROM sense and measurement devices is illustrated with effects of various charge control systems and the influence of resist patterning on the net current flow to the wafer. The special challenges of space charge control for sub-keV ion beams and the impact on local doping uniformity are also discussed
  • Keywords
    EPROM; electric sensing devices; ion implantation; plasma density; plasma materials processing; plasma temperature; semiconductor doping; EEPROM; charge control; current-voltage characteristics; ion implantation; local doping uniformity; measurement devices; net ion density; plasma electron temperature; plasma ion mass; resist patterning; sensing devices; space charge; sub-keV ion beams; wafer charging; Electrons; Ion beams; Ion implantation; Plasma density; Plasma devices; Plasma immersion ion implantation; Plasma measurements; Plasma properties; Plasma sources; Plasma temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 2000 5th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    0-9651577-4-1
  • Type

    conf

  • DOI
    10.1109/PPID.2000.870642
  • Filename
    870642