Title :
Investigation of Degradation Factors for Adaptive Modulation and Coding in OFDM-MIMO Multiplexing
Author :
Bing Han ; Kawamura, Toshihiko ; Kakishima, Yuichi ; Sawahashi, Mamoru
Author_Institution :
Tokyo City Univ., Tokyo, Japan
Abstract :
This paper investigates the throughput performance using adaptive modulation and coding (AMC) focusing on the causes of impairment to Orthogonal Frequency Division Multiplexing (OFDM) - Multiple-Input Multiple-Output (MIMO) multiplexing. We first investigate the influence of a limited number of modulation and coding schemes (MCSs) and channel estimation error for MCS selection based on mutual information (MI). Second, we clarify the effect of MCS selection error on an increasing maximum Doppler frequency due to the round trip delay time (RTT) in comparison to the throughput upper bound that is computed from the MCS combination providing the maximum throughput considering the block error. Third, we clarify the effect of channel estimation error of maximum likelihood detection (MLD) when using reference signal (RS) based channel estimation in comparison to ideal channel estimation. Through the evaluations, we clarify the impairment factors that degrade the achievable throughput for OFDM-MIMO multiplexing using AMC in an actual multipath fading channel.
Keywords :
MIMO communication; OFDM modulation; adaptive codes; adaptive modulation; channel estimation; fading channels; maximum likelihood detection; multipath channels; Doppler frequency; MLD; OFDM-MIMO multiplexing; RTT; adaptive coding; adaptive modulation; channel estimation error; coding schemes; degradation factors; maximum likelihood detection; modulation schemes; multipath fading channel; multiple-input multiple-output multiplexing; mutual information; orthogonal frequency division multiplexing; reference signal; round trip delay time; throughput performance; Channel estimation; Modulation; OFDM; Receivers; Signal to noise ratio; Throughput; Upper bound;
Conference_Titel :
Vehicular Technology Conference (VTC Spring), 2014 IEEE 79th
Conference_Location :
Seoul
DOI :
10.1109/VTCSpring.2014.7022957