DocumentCode :
2442399
Title :
On the mechanism of plasma enhanced dielectric deposition charging damage
Author :
Cheung, Kin P.
Author_Institution :
Lucent Technol. Bell Labs., USA
fYear :
2000
fDate :
2000
Firstpage :
161
Lastpage :
163
Abstract :
Photoconduction is shown to be the mechanism for plasma charging damage during plasma enhanced dielectric deposition. Details of the conduction process, including polarity effects, are explained. The recently measured oxide photoconductivity is shown to be in agreement with expectation. The main cause of severe charging damage is the low level of photoconduction coupled with high processing temperature
Keywords :
dielectric thin films; photoconductivity; plasma deposition; charging damage; photoconduction; plasma enhanced dielectric deposition; polarity; processing temperature; Dielectric measurements; Electrical resistance measurement; Electrodes; Electrons; Leakage current; Photoconductivity; Photoelectricity; Plasma materials processing; Plasma measurements; Plasma temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 2000 5th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-9651577-4-1
Type :
conf
DOI :
10.1109/PPID.2000.870658
Filename :
870658
Link To Document :
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