DocumentCode
2442730
Title
Drain leakage mechanisms in fully depleted SOI devices with undoped channel [MOSFETs]
Author
Luyken, R.J. ; Specht, M. ; Rösner, K. ; Hartwich, J. ; Hofmann, F. ; Dreeskornfeld, L. ; Landgraf, E. ; Schulz, T. ; Städele, M. ; Kretz, J. ; Risch, L.
Author_Institution
Corporate Res., Infineon Technol., Munchen, Germany
fYear
2003
fDate
16-18 Sept. 2003
Firstpage
419
Lastpage
422
Abstract
The leakage mechanisms in fully depleted (FD) SOI transistors with undoped channel are investigated. These devices - contrary to partially depleted devices - show a strong V/sub DS/ dependence of the leakage currents. Energy balance simulations, including band to band tunneling effects and impact ionization, have been carried out. Contrary to drift diffusion calculations, these simulations can account for the experimental data and show that the two effects can be separated. In order to reduce these leakage effects, the design of the drain has to be optimised.
Keywords
MOSFET; impact ionisation; leakage currents; semiconductor device models; silicon-on-insulator; tunnelling; MOSFET; drain design optimisation; drain leakage mechanisms; energy balance simulation; fully depleted SOI transistors; impact ionization; inter-band tunneling effects; leakage currents; undoped channel SOI transistors; CMOS technology; Design optimization; Electron beams; Impact ionization; Leakage current; Lithography; Semiconductor device modeling; Semiconductor process modeling; Silicon; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location
Estoril, Portugal
Print_ISBN
0-7803-7999-3
Type
conf
DOI
10.1109/ESSDERC.2003.1256903
Filename
1256903
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