DocumentCode :
2442730
Title :
Drain leakage mechanisms in fully depleted SOI devices with undoped channel [MOSFETs]
Author :
Luyken, R.J. ; Specht, M. ; Rösner, K. ; Hartwich, J. ; Hofmann, F. ; Dreeskornfeld, L. ; Landgraf, E. ; Schulz, T. ; Städele, M. ; Kretz, J. ; Risch, L.
Author_Institution :
Corporate Res., Infineon Technol., Munchen, Germany
fYear :
2003
fDate :
16-18 Sept. 2003
Firstpage :
419
Lastpage :
422
Abstract :
The leakage mechanisms in fully depleted (FD) SOI transistors with undoped channel are investigated. These devices - contrary to partially depleted devices - show a strong V/sub DS/ dependence of the leakage currents. Energy balance simulations, including band to band tunneling effects and impact ionization, have been carried out. Contrary to drift diffusion calculations, these simulations can account for the experimental data and show that the two effects can be separated. In order to reduce these leakage effects, the design of the drain has to be optimised.
Keywords :
MOSFET; impact ionisation; leakage currents; semiconductor device models; silicon-on-insulator; tunnelling; MOSFET; drain design optimisation; drain leakage mechanisms; energy balance simulation; fully depleted SOI transistors; impact ionization; inter-band tunneling effects; leakage currents; undoped channel SOI transistors; CMOS technology; Design optimization; Electron beams; Impact ionization; Leakage current; Lithography; Semiconductor device modeling; Semiconductor process modeling; Silicon; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7999-3
Type :
conf
DOI :
10.1109/ESSDERC.2003.1256903
Filename :
1256903
Link To Document :
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