• DocumentCode
    2442730
  • Title

    Drain leakage mechanisms in fully depleted SOI devices with undoped channel [MOSFETs]

  • Author

    Luyken, R.J. ; Specht, M. ; Rösner, K. ; Hartwich, J. ; Hofmann, F. ; Dreeskornfeld, L. ; Landgraf, E. ; Schulz, T. ; Städele, M. ; Kretz, J. ; Risch, L.

  • Author_Institution
    Corporate Res., Infineon Technol., Munchen, Germany
  • fYear
    2003
  • fDate
    16-18 Sept. 2003
  • Firstpage
    419
  • Lastpage
    422
  • Abstract
    The leakage mechanisms in fully depleted (FD) SOI transistors with undoped channel are investigated. These devices - contrary to partially depleted devices - show a strong V/sub DS/ dependence of the leakage currents. Energy balance simulations, including band to band tunneling effects and impact ionization, have been carried out. Contrary to drift diffusion calculations, these simulations can account for the experimental data and show that the two effects can be separated. In order to reduce these leakage effects, the design of the drain has to be optimised.
  • Keywords
    MOSFET; impact ionisation; leakage currents; semiconductor device models; silicon-on-insulator; tunnelling; MOSFET; drain design optimisation; drain leakage mechanisms; energy balance simulation; fully depleted SOI transistors; impact ionization; inter-band tunneling effects; leakage currents; undoped channel SOI transistors; CMOS technology; Design optimization; Electron beams; Impact ionization; Leakage current; Lithography; Semiconductor device modeling; Semiconductor process modeling; Silicon; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
  • Conference_Location
    Estoril, Portugal
  • Print_ISBN
    0-7803-7999-3
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2003.1256903
  • Filename
    1256903