DocumentCode :
2443245
Title :
The impact of channel engineering on the performance reliability and scaling of CHISEL NOR flash EEPROMs
Author :
Mohapatra, Nihar R. ; Nair, Deleep R. ; Mahapatra, S. ; Rao, V. Ramgopal ; Shukuri, S.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
fYear :
2003
fDate :
16-18 Sept. 2003
Firstpage :
541
Lastpage :
544
Abstract :
The programming performance, cycling endurance and scaling of CHISEL NOR flash EEPROMs is studied for two different (halo and no-halo) channel engineering schemes. Programming speed under identical bias, bias requirements under similar programming time, cycling endurance and drain disturb are compared. The scaling properties of programming time (at a fixed bias), bias (at a fixed programming time) and program/disturb margin are studied as cell floating gate length is scaled. The relative merits of these channel engineering schemes are discussed from the viewpoint of futuristic CHISEL cell design.
Keywords :
NOR circuits; flash memories; integrated circuit reliability; CHISEL programming mechanism; EEPROM performance reliability; EEPROM scaling; NOR flash EEPROM; cell floating gate length; channel initiated secondary electron injection; cycling endurance; drain disturb; no-halo channel engineering; program/disturb margin; programming speed; Design engineering; Doping; EPROM; Implants; Integrated circuit reliability; Integrated circuit technology; Performance evaluation; Power engineering and energy; Reliability engineering; Semiconductor device reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
European Solid-State Device Research, 2003. ESSDERC '03. 33rd Conference on
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7999-3
Type :
conf
DOI :
10.1109/ESSDERC.2003.1256933
Filename :
1256933
Link To Document :
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