• DocumentCode
    2444030
  • Title

    Characteristics of the microplasma generated in a flexible plasma device

  • Author

    Kim, Seung Hun ; Mun, Jeong Hun ; Yang, Ki Youl ; Kim, Kuk Joo ; Choi, Kyung Cheol

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., KAIST, Daejeon
  • fYear
    2008
  • fDate
    15-19 June 2008
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    In this paper microplasma generated in a flexible plasma device was investigated. Various plastic films were used as front and rear substrates to fabricate the flexible plasma device. On the rear substrate, a copper metal was patterned as sustain electrodes via the thermal evaporation and a photolithography method. Following this, a dielectric and a MgO protective layers were coated via spin coating and e-beam evaporation method, respectively. Barrier ribs were formed to make the discharge space between front and rear substrates. Finally, the two substrates were sealed. The Ne gas was used as a discharge gas. From the measurement results, microplasma showed the different electrical and optical characteristics in accordance with a variation of the thickness of the dielectric layer and a gas pressure. Additionally, the microplasma characteristics were investigated by varying the aging time of the MgO layer.
  • Keywords
    copper; discharges (electric); electron beam deposition; neon; photolithography; plasma devices; plasma dielectric properties; plasma transport processes; polymer films; spin coating; vacuum deposition; Cu; Ne; barrier ribs; copper metal; dielectric layer; discharge space; e-beam evaporation; electrical peoperty; electrodes; flexible plasma device; gas pressure; microplasma; optical property; photolithography; plastic films; protective layers; rear substrate; spin coating; thermal evaporation; Character generation; Coatings; Copper; Dielectric substrates; Electrodes; Lithography; Plasma devices; Plastic films; Protection; Ribs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2008. ICOPS 2008. IEEE 35th International Conference on
  • Conference_Location
    Karlsruhe
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-1929-6
  • Electronic_ISBN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2008.4591138
  • Filename
    4591138