• DocumentCode
    2444637
  • Title

    Improved analytical delay models for coupled interconnects

  • Author

    Shi, Feng ; Wu, Xuebin ; Yan, Zhiyuan

  • Author_Institution
    Dept. of ECE, Lehigh Univ., Bethlehem, PA, USA
  • fYear
    2011
  • fDate
    4-7 Oct. 2011
  • Firstpage
    134
  • Lastpage
    139
  • Abstract
    With the advance of the process technologies into deep sub-micrometer domain, crosstalk between adjacent wires of global interconnects has become more severe. The delay caused by the crosstalk becomes a bottleneck to system performance, especially those with global interconnects. To alleviate crosstalk delays, accurate delay models are needed. In particular, analytical models are more desirable for their simplicity and transparency to technology, which lead to efficient crosstalk avoidance code (CAC) designs. Currently, most existing CAC designs are based on the analytical model proposed by Sotiriadis et al., which has limited accuracy. In this paper, we propose new analytical delay models, and our extensive simulations show that they have improved accuracy.
  • Keywords
    crosstalk; integrated circuit interconnections; analytical delay models; coupled interconnects; crosstalk avoidance code designs; crosstalk delays; Accuracy; Analytical models; Crosstalk; Delay; Integrated circuit modeling; Wires; Crosstalk; delay; interconnects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing Systems (SiPS), 2011 IEEE Workshop on
  • Conference_Location
    Beirut
  • ISSN
    2162-3562
  • Print_ISBN
    978-1-4577-1920-2
  • Type

    conf

  • DOI
    10.1109/SiPS.2011.6088963
  • Filename
    6088963