DocumentCode :
2444637
Title :
Improved analytical delay models for coupled interconnects
Author :
Shi, Feng ; Wu, Xuebin ; Yan, Zhiyuan
Author_Institution :
Dept. of ECE, Lehigh Univ., Bethlehem, PA, USA
fYear :
2011
fDate :
4-7 Oct. 2011
Firstpage :
134
Lastpage :
139
Abstract :
With the advance of the process technologies into deep sub-micrometer domain, crosstalk between adjacent wires of global interconnects has become more severe. The delay caused by the crosstalk becomes a bottleneck to system performance, especially those with global interconnects. To alleviate crosstalk delays, accurate delay models are needed. In particular, analytical models are more desirable for their simplicity and transparency to technology, which lead to efficient crosstalk avoidance code (CAC) designs. Currently, most existing CAC designs are based on the analytical model proposed by Sotiriadis et al., which has limited accuracy. In this paper, we propose new analytical delay models, and our extensive simulations show that they have improved accuracy.
Keywords :
crosstalk; integrated circuit interconnections; analytical delay models; coupled interconnects; crosstalk avoidance code designs; crosstalk delays; Accuracy; Analytical models; Crosstalk; Delay; Integrated circuit modeling; Wires; Crosstalk; delay; interconnects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing Systems (SiPS), 2011 IEEE Workshop on
Conference_Location :
Beirut
ISSN :
2162-3562
Print_ISBN :
978-1-4577-1920-2
Type :
conf
DOI :
10.1109/SiPS.2011.6088963
Filename :
6088963
Link To Document :
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