Title :
Power supply wires self-heating analysis
Author :
Casu, M. ; Graziano, M. ; Roch, M. Ruo ; Viglione, F.
Author_Institution :
VLSI Lab., Politecnico di Torino, Italy
Abstract :
Self-heating is one of the major problems of high performance ICs due to scaled feature sizes, interconnect congestion and increased current densities. As a consequence, particular attention is necessary to avoid reliability drawbacks. In this paper we report analysis results achieved evaluating self-heating of power supply busses in presence of current injection related to different working conditions. This set of estimations has been realized considering three distinct metal layers and two logic families. This analysis and optimization methodology and results will be inserted in a developing tool for power supply noise evaluation and reduction, with the aim to take into account thermal phenomena while optimizing power bus sizing and routing for noise avoidance.
Keywords :
circuit CAD; current density; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; logic CAD; network routing; power supply circuits; wiring; current densities; current injection; high performance ICs; interconnect congestion; logic families; metal layers; power bus sizing; power supply wires; reliability; routing; scaled feature sizes; self-heating analysis; thermal phenomena; working conditions; Circuit simulation; Current density; Frequency; Logic; Noise reduction; Optimization methods; Power supplies; Temperature; Very large scale integration; Wires;
Conference_Titel :
Microelectronics, 2001. ICM 2001 Proceedings. The 13th International Conference on
Print_ISBN :
0-7803-7522-X
DOI :
10.1109/ICM.2001.997501
