DocumentCode
2445635
Title
MMIC / multi-ship module
Author
Sudbury, Roger ; Sullivan, Frank J. ; Chu, Alejandro
Author_Institution
Lincoln Lab., MIT, Lexington, MA, USA
fYear
2003
fDate
14-17 Oct. 2003
Firstpage
612
Abstract
Summary form only given. The tutorial will focus on the state-of-the-art solid-state multichip module technology for phased-array applications. Increasingly, solid-state highly integrated monolithic microwave integrated circuit (MMIC) components in multichip modules are being utilized in radar and communications arrays for military and civilian applications. The general design requirement resulting from system considerations is the starting point of this tutorial. The focus is on the component design and development, rather that system trade-offs. As future applications evolve, optimization of module design requires innovative solutions for conformal and space-based radar applications. The evolution of MMIC´s to higher performance effects considerations beyond the solid-state componentry. Important issues in multichip modules in addition to the semiconductor chip set involve packaging, thermal control, test capability and production. The tutorial covers the achievement in solid-state capability across a wide spectrum., digital components in multimode modules, analog power, low noise, and phase-control circuitry. Examples are used to demonstrate the ability to design, fabricate, package, and test multichip modules with leading research and industrial engineers describing their experiences in these areas.
Keywords
MMIC; antenna phased arrays; chip scale packaging; modules; optimisation; phase control; monolithic microwave integrated circuit; optimization; packaging; phase-control circuitry; phased-array applications; radar applications; semiconductor chip set; solid-state multichip module technology; test capability; thermal control; Application specific integrated circuits; Circuit testing; Integrated circuit technology; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Multichip modules; Radar applications; Semiconductor device packaging; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Phased Array Systems and Technology, 2003. IEEE International Symposium on
Print_ISBN
0-7803-7827-X
Type
conf
DOI
10.1109/PAST.2003.1257052
Filename
1257052
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