Title :
A novel micro-capillary groove-wick miniature heat pipe
Author :
Ponnappan, Rengasamy
Author_Institution :
Power Div., Wright R&D Center, Wright-Patterson AFB, OH, USA
Abstract :
Miniature heat pipes (MHP) are passive heat transport devices mainly considered in electronics packaging for high heat flux acquisition and transport and their applications could include thermal management of a variety of electronic devices such as computer processors and laser diodes. This paper describes a novel screen wick design suitable for miniature heat pipes. The new design promises improved performance and ease of fabrication and is recommended in place of the familiar forms of the rectangular groove design miniature heat pipes. Design and fabrication details along with steady state horizontal orientation performance test results of a proof-of-concept rectangular copper-water heat pipe are presented. Heat flux, temperature difference and heat transfer coefficient data are compared with the literature data of a comparable flat miniature heat pipe with machined groove wick. The performance of the new design matches the comparable groove design. The evaporator heat flux of the present design was 115 W/cm2 at the operating temperature of 90°C and evaporator-to-adiabatic temperature difference of 37°C. Results on the heat transfer coefficients are also presented
Keywords :
heat pipes; heat transfer; thermal management (packaging); 37 C; 90 C; comparable flat miniature heat pipe; computer processors; electronics packaging; evaporator heat flux; evaporator-to-adiabatic temperature difference; fabrication; heat flux; heat transfer coefficient data; heat transfer coefficients; high heat flux acquisition; laser diodes; machined groove wick; micro-capillary groove-wick miniature heat pipe; passive heat transport devices; proof-of-concept rectangular copper-water heat pipe; steady state horizontal orientation performance; temperature difference; thermal management; Application software; Diode lasers; Electronic packaging thermal management; Electronics packaging; Heat transfer; Optical device fabrication; Steady-state; Temperature; Thermal management; Thermal management of electronics;
Conference_Titel :
Energy Conversion Engineering Conference and Exhibit, 2000. (IECEC) 35th Intersociety
Conference_Location :
Las Vegas, NV
Print_ISBN :
1-56347-375-5
DOI :
10.1109/IECEC.2000.870879