DocumentCode :
2446680
Title :
Thermal-sprayed, thin-film pyrite cathodes for thermal batteries-discharge-rate and temperature studies in single cells
Author :
Guidotti, Ronald A. ; Reinhardt, Frederick W. ; Dai, Jinxiang ; Xiao, T. Danny ; Reisner, Davd
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
2
fYear :
2000
fDate :
2000
Firstpage :
976
Abstract :
Using an optimized thermal-spray process, coherent, dense deposits of pyrite (FeS2) with good adhesion were formed on 304 stainless steel substrates (current collectors). After leaching with CS 2 to remove residual free sulfur, these served as cathodes in Li(Si)/FeS2 thermal cells. The cells were tested over a temperature range of 450°C to 550°C under baseline loads of 125 and 250 mA/cm2, to simulate conditions found in a thermal battery. Cells built with such cathodes outperformed standard cells made with pressed-powder parts. They showed lower interfacial resistance and polarization throughout discharge, with higher capacities per mass of pyrite. Post-treatment of the cathodes with Li2O coatings at levels of >7% by weight of the pyrite was found to eliminate the voltage transient normally observed for these materials. Results equivalent to those of standard lithiated catholytes were obtained in this manner. The use of plasma-sprayed cathodes allows the use of much thinner cells for thermal batteries since only enough material needs to be deposited as the capacity requirements of a given application demand
Keywords :
cathodes; iron compounds; plasma arc sprayed coatings; polarisation; primary cells; thin films; 304 stainless steel substrates; 450 to 550 C; CS2; CS2 leaching; Li(Si)-FeS2; Li(Si)/FeS2 thermal cells; Li2O; Li2O coatings; adhesion; discharge-rate; lower interfacial resistance; plasma-sprayed cathodes; polarization; pressed-powder parts; residual free sulfur removal; single cells; temperature studies; thermal batteries; thermal-sprayed thin-film pyrite cathodes; voltage transient elimination; Adhesives; Batteries; Cathodes; Leaching; Plasma temperature; Steel; Substrates; Temperature distribution; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference and Exhibit, 2000. (IECEC) 35th Intersociety
Conference_Location :
Las Vegas, NV
Print_ISBN :
1-56347-375-5
Type :
conf
DOI :
10.1109/IECEC.2000.870899
Filename :
870899
Link To Document :
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