DocumentCode :
2447322
Title :
A micro-hotplate-based monolithic CMOS thermal analysis system
Author :
Barrettino, D. ; Song, W.H. ; Graf, M. ; Hierlemann, A. ; Baltes, H.
Author_Institution :
Phys. Electron. Lab., ETH Zurich, Switzerland
fYear :
2003
fDate :
16-18 Sept. 2003
Firstpage :
329
Lastpage :
332
Abstract :
A novel monolithic differential thermal analyzer fabricated in industrial CMOS-technology combined with post-CMOS micromachining is presented, which includes three micro-hotplates and all necessary driving and signal conditioning circuitry. Three on-chip proportional temperature controllers (one controller per micro-hotplate), regulate the micro-hotplate temperature up to 350/spl deg/C with a steady-state error of less than 1% of the preset micro-hotplate temperature. A circular micro-hotplate design was developed to improve the hotplate power efficiency. The thermal analysis performance was assessed by melting point measurements of ammonium nitrate (melting point at 169.6/spl deg/C).
Keywords :
CMOS integrated circuits; controllers; micromachining; monolithic integrated circuits; temperature control; thermal analysis; 169.6 C; ammonium nitrate; circular micro-hotplate design; driving circuitry; hotplate power efficiency; industrial CMOS-technology; melting point measurements; micro-hotplate temperature; micro-hotplate-based monolithic CMOS; monolithic differential thermal analyzer; on-chip proportional temperature controllers; post-CMOS micromachining; signal conditioning circuitry; thermal analysis performance; thermal analysis system; Circuits; Electrical equipment industry; Error correction; Micromachining; Performance analysis; Proportional control; Signal analysis; Steady-state; Temperature control; Textile industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2003. ESSCIRC '03. Proceedings of the 29th European
Conference_Location :
Estoril, Portugal
Print_ISBN :
0-7803-7995-0
Type :
conf
DOI :
10.1109/ESSCIRC.2003.1257139
Filename :
1257139
Link To Document :
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