Title :
Virtual Reality for 2.5 G Wireless Communication Modem Software Development
Author :
Pegatoquet, Alain ; Thoen, Filip ; Paterson, Denis
Author_Institution :
Texas Instrum., Wireless Terminal Bus. Unit
fDate :
July 28 2008-Aug. 1 2008
Abstract :
Systems such as wireless handsets include an integrated System-On-Chip (SoC) often based on a multi-core architecture, with at least one Digital Signal Processor (DSP) and one Micro Controller Unit (MCU) core. Validating the application and modem software that runs on these devices is a lengthy task. Moreover, the earlier software developers can access a realistic platform of the system, the earlier they can validate their software and ship a product. Synopsys DesignWareTM Virtual Platform is a product to enable pre-silicon software development, which allows software developers to develop and test software earlier, thus reducing time-to-market. In order to demonstrate virtual platform capabilities, OMAPV1030 layer-1 stand-alone modem software has been validated on the corresponding virtual platform. Using this methodology, a GSM call and both GRPS and EGPRS packet transfers have been performed purely in simulation. In addition, this paper describes how RF and audio data, to feed the virtual platform, have been collected.
Keywords :
3G mobile communication; device drivers; modems; program testing; 2.5 G wireless communication modem; EGPRS packet transfers; GRPS packet transfers; GSM; OMAPV1030 layer-1 stand-alone modem software; Synopsys DesignWare Virtual Platform; digital signal processor; earlier; integrated system-on-chip; micro controller unit core; multicore architecture; pre-silicon software development; software testing; virtual reality; Communication system control; Computer architecture; Digital signal processing; Digital signal processors; Modems; Programming; System-on-a-chip; Telephone sets; Virtual reality; Wireless communication; EGPRS; GPRS; GSM; MPSoC; Virtual platform; simulation;
Conference_Titel :
Computer Software and Applications, 2008. COMPSAC '08. 32nd Annual IEEE International
Conference_Location :
Turku
Print_ISBN :
978-0-7695-3262-2
Electronic_ISBN :
0730-3157
DOI :
10.1109/COMPSAC.2008.101