Title :
A Collaborative Kalman Filter for Time-Evolving Dyadic Processes
Author :
Gultekin, San ; Paisley, John
Author_Institution :
Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Abstract :
We present the collaborative Kalman filter (CKF), a dynamic model for collaborative filtering and related factorization models. Using the matrix factorization approach to collaborative filtering, the CKF accounts for time evolution by modeling each low-dimensional latent embedding as a multidimensional Brownian motion. Each observation is a random variable whose distribution is parameterized by the dot product of the relevant Brownian motions at that moment in time. This is naturally interpreted as a Kalman filter with multiple interacting state space vectors. We also present a method for learning a dynamically evolving drift parameter for each location by modeling it as a geometric Brownian motion. We handle posterior intractability via a mean-field variational approximation, which also preserves tractability for downstream calculations in a manner similar to the Kalman filter. We evaluate the model on several large datasets, providing quantitative evaluation on the 10 million Movie lens and 100 million Netflix datasets and qualitative evaluation on a set of 39 million stock returns divided across roughly 6,500 companies from the years 1962-2014.
Keywords :
Brownian motion; Kalman filters; approximation theory; collaborative filtering; learning (artificial intelligence); matrix decomposition; CKF; Movie lens datasets; Netflix datasets; collaborative Kalman filter; dot product; drift parameter; geometric Brownian motion; low-dimensional latent modelling; matrix factorization approach; mean-field variational approximation; multidimensional Brownian motion; multiple interacting state space vectors; posterior intractability; random variable; time-evolving dyadic processes; Approximation methods; Collaboration; Data models; Equations; Kalman filters; Mathematical model; Vectors;
Conference_Titel :
Data Mining (ICDM), 2014 IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4799-4303-6
DOI :
10.1109/ICDM.2014.61