• DocumentCode
    244957
  • Title

    Electromagnetic analysis of conductor track surface roughnesses from 1 GHz to 110 GHz

  • Author

    Talai, Armin ; Steinhausser, F. ; Gmeiner, B. ; Wegener, Martin ; Bittner, Achim ; Deisinger, U. ; Schmid, Ulrich ; Roosen, A. ; Weigel, Robert ; Koelpin, Alexander

  • Author_Institution
    Inst. for Electron. Eng., Friedrich-Alexander-Univ. Erlangen-Nuremberg, Erlangen, Germany
  • fYear
    2014
  • fDate
    3-8 Aug. 2014
  • Firstpage
    415
  • Lastpage
    418
  • Abstract
    Conductor tracks comprise a frequency dependent attenuation of electromagnetic waves, since with increasing frequency the current flow is displaced to the near surface region due to the skin effect. Therefore, the effective length of the conductor is increased by the surface roughness, while its effective cross-section is decreased by current displacement, both leading to higher metallization loss. In this paper, surface topographies of typical conductor materials were recorded by confocal microscopy and rebuilt as 3D CAD models. Subsequent electromagnetic simulations reveal the influence due to roughness on high frequency characteristics for physical vapor deposited, thick film and photochemically etched microstrips.
  • Keywords
    CAD; optical microscopy; skin effect; surface roughness; thin films; 3D CAD models; conductor track surface roughness; current displacement; current flow frequency; effective cross-section; electromagnetic analysis; electromagnetic waves; frequency 1 GHz to 110 GHz; frequency dependent attenuation; metallization loss; photochemically etched microstrips; physical vapor deposited film; skin effect; surface topographies; thick film; Design automation; Gold; Materials; Metallization; Rough surfaces; Solid modeling; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetics in Advanced Applications (ICEAA), 2014 International Conference on
  • Conference_Location
    Palm Beach
  • Print_ISBN
    978-1-4799-7325-5
  • Type

    conf

  • DOI
    10.1109/ICEAA.2014.6903887
  • Filename
    6903887