DocumentCode :
245066
Title :
A stacked sensor concept for industry compatible plasma diagnostics
Author :
Schulz, Claudia ; Will, Bianca ; Rolfes, Ilona
Author_Institution :
Inst. of Microwave Syst., Ruhr-Univ. Bochum, Bochum, Germany
fYear :
2014
fDate :
3-8 Aug. 2014
Firstpage :
683
Lastpage :
686
Abstract :
This paper presents a stacked sensor concept, which is producible entirely on standard printed circuit boards and applicable for the control of industrial plasma processes. Starting with the so-called multipole resonance probe (MRP) the prospects and the development towards the stacked MRP (sMRP) are discussed. The conversion of the MRP into a discretized spherical setup, using printed half discs of varying radii, is investigated. 3D electromagnetic field simulations yield an optimized assembly of 25 PCBs for a replication of the probe head. Measurements of a first prototype in a double inductive coupled plasma with an excited argon-hydrogen plasma have proven the expected resonance behaviour. In comparison to the MRP and the simulations, the applicability of the stacked sensor concept is demonstrated.
Keywords :
electromagnetic fields; plasma devices; plasma probes; printed circuits; sensors; 3D electromagnetic field simulations; PCB optimized assembly; discretized spherical setup; double inductive coupled plasma; excited argon-hydrogen plasma; industrial plasma process control; industry compatible plasma diagnostics; multipole resonance probe; printed half discs; probe head replication; resonance behaviour; stacked MRP; stacked sensor concept; standard printed circuit boards; Materials requirements planning; Plasma measurements; Plasmas; Probes; Process control; Resonant frequency; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetics in Advanced Applications (ICEAA), 2014 International Conference on
Conference_Location :
Palm Beach
Print_ISBN :
978-1-4799-7325-5
Type :
conf
DOI :
10.1109/ICEAA.2014.6903945
Filename :
6903945
Link To Document :
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