• DocumentCode
    245066
  • Title

    A stacked sensor concept for industry compatible plasma diagnostics

  • Author

    Schulz, Claudia ; Will, Bianca ; Rolfes, Ilona

  • Author_Institution
    Inst. of Microwave Syst., Ruhr-Univ. Bochum, Bochum, Germany
  • fYear
    2014
  • fDate
    3-8 Aug. 2014
  • Firstpage
    683
  • Lastpage
    686
  • Abstract
    This paper presents a stacked sensor concept, which is producible entirely on standard printed circuit boards and applicable for the control of industrial plasma processes. Starting with the so-called multipole resonance probe (MRP) the prospects and the development towards the stacked MRP (sMRP) are discussed. The conversion of the MRP into a discretized spherical setup, using printed half discs of varying radii, is investigated. 3D electromagnetic field simulations yield an optimized assembly of 25 PCBs for a replication of the probe head. Measurements of a first prototype in a double inductive coupled plasma with an excited argon-hydrogen plasma have proven the expected resonance behaviour. In comparison to the MRP and the simulations, the applicability of the stacked sensor concept is demonstrated.
  • Keywords
    electromagnetic fields; plasma devices; plasma probes; printed circuits; sensors; 3D electromagnetic field simulations; PCB optimized assembly; discretized spherical setup; double inductive coupled plasma; excited argon-hydrogen plasma; industrial plasma process control; industry compatible plasma diagnostics; multipole resonance probe; printed half discs; probe head replication; resonance behaviour; stacked MRP; stacked sensor concept; standard printed circuit boards; Materials requirements planning; Plasma measurements; Plasmas; Probes; Process control; Resonant frequency; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetics in Advanced Applications (ICEAA), 2014 International Conference on
  • Conference_Location
    Palm Beach
  • Print_ISBN
    978-1-4799-7325-5
  • Type

    conf

  • DOI
    10.1109/ICEAA.2014.6903945
  • Filename
    6903945