DocumentCode
2450913
Title
Modeling and simulation of phonon boundary scattering in PDE-based device simulators
Author
Tornblad, O. ; Sverdrup, P.G. ; Yergeau, D. ; Yu, Z. ; Goodson, K.E. ; Dutton, R.W.
Author_Institution
Center for Integrated Syst., Stanford Univ., CA, USA
fYear
2000
fDate
2000
Firstpage
58
Lastpage
61
Abstract
In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase ~30% higher at the gate oxide interface compared to conventional modeling
Keywords
Boltzmann equation; MOSFET; finite element analysis; interface phenomena; partial differential equations; phonons; scattering; semiconductor device models; technology CAD (electronics); thermal analysis; thermal conductivity; MOSFET; PDE-based device simulators; PROPHET device simulator; SOI devices; Si; Si-SiO2; anisotropic local thermal conductivity; bulk device; electrothermal modeling; finite element-based operator; gate oxide interface temperature; heat transfer; interface heat transfer; linearized Boltzmann transport equation; modeling; phonon boundary scattering; silicon-on-insulator devices; simulation; thin silicon layers; Anisotropic magnetoresistance; Boltzmann equation; Electrothermal effects; Finite element methods; Heat transfer; MOSFET circuits; Phonons; Scattering; Silicon on insulator technology; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-6279-9
Type
conf
DOI
10.1109/SISPAD.2000.871206
Filename
871206
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