• DocumentCode
    2450913
  • Title

    Modeling and simulation of phonon boundary scattering in PDE-based device simulators

  • Author

    Tornblad, O. ; Sverdrup, P.G. ; Yergeau, D. ; Yu, Z. ; Goodson, K.E. ; Dutton, R.W.

  • Author_Institution
    Center for Integrated Syst., Stanford Univ., CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    58
  • Lastpage
    61
  • Abstract
    In this work, the effect of phonon boundary scattering on the heat transfer in thin silicon layers and close to interfaces was investigated. The modeling is applicable to silicon-on-insulator (SOI) devices as well as to conventional bulk technology. From a linearized Boltzmann transport equation (BTE), anisotropic local thermal conductivities are derived. A separate expression is formulated for the case of a bulk device where only one interface is present. Anisotropy was implemented as a finite element-based operator into the PROPHET device simulator and a demonstration of the new electrothermal modeling was made for a conventional MOSFET. The anisotropic local thermal conductivities lead to a temperature increase ~30% higher at the gate oxide interface compared to conventional modeling
  • Keywords
    Boltzmann equation; MOSFET; finite element analysis; interface phenomena; partial differential equations; phonons; scattering; semiconductor device models; technology CAD (electronics); thermal analysis; thermal conductivity; MOSFET; PDE-based device simulators; PROPHET device simulator; SOI devices; Si; Si-SiO2; anisotropic local thermal conductivity; bulk device; electrothermal modeling; finite element-based operator; gate oxide interface temperature; heat transfer; interface heat transfer; linearized Boltzmann transport equation; modeling; phonon boundary scattering; silicon-on-insulator devices; simulation; thin silicon layers; Anisotropic magnetoresistance; Boltzmann equation; Electrothermal effects; Finite element methods; Heat transfer; MOSFET circuits; Phonons; Scattering; Silicon on insulator technology; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-6279-9
  • Type

    conf

  • DOI
    10.1109/SISPAD.2000.871206
  • Filename
    871206