Title :
Modeling of boron deactivation/activation kinetics during ion implant annealing
Author :
Chakravarthi, Srinivasan ; Dunham, Scott T.
Author_Institution :
Dept. of Manuf. Eng., Boston Univ., MA, USA
Abstract :
Boron transient enhanced diffusion (TED) is characterized by enhanced tail diffusion coupled with an electrically inactive immobile peak associated with the clustering of boron in the presence of excess interstitials. A consistent model for process simulation has to account for the formation of a variety of agglomerates associated with the excess point defect concentrations following ion implantation. These include interstitial clusters (e.g. {311} defects), vacancy clusters and dopant/interstitial clusters (e.g. boron interstitial clusters). In addition to the chemical profiles (SIMS), it is essential to also predict electrical activation behavior. Hence, in this work we investigate models for boron deactivation and subsequent activation during annealing
Keywords :
annealing; boron; diffusion; doping profiles; elemental semiconductors; impurity-defect interactions; interstitials; ion implantation; mass spectroscopic chemical analysis; secondary ion mass spectra; segregation; semiconductor process modelling; silicon; vacancies (crystal); SIMS chemical profiles; Si:B; agglomerate formation; annealing; boron activation kinetics; boron clustering; boron deactivation kinetics; boron interstitial clusters; boron transient enhanced diffusion; dopant/interstitial clusters; electrical activation; electrically inactive immobile peak; enhanced tail diffusion; excess interstitials; excess point defect concentrations; interstitial clusters; ion implant annealing; ion implantation; modeling; process simulation model; vacancy clusters; Annealing; Boron; Chemicals; Implants; Ion implantation; Kinetic theory; Predictive models; Semiconductor process modeling; Tail; Temperature;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-6279-9
DOI :
10.1109/SISPAD.2000.871234