The Best Paper Award winner is "Flexible Packed Stencil Design with Multiple Shaping Apertures for E-Beam Lithography" by Chris Chu (Iowa State Univ., USA), Wai-Kei Mak (National Tsing Hua Univ., Taiwan).
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2014 19th Asia and South Pacific
