DocumentCode :
2452459
Title :
Poly(ether-imide) thin films with/without fluorine in the structure
Author :
Hamciuc, Elena ; Hamciuc, Corneliu ; Bacosca, Irina ; Cazacu, Maria
Author_Institution :
Petru Poni Inst. of Macromolecular Chem., Iasi, Romania
Volume :
2
fYear :
2009
fDate :
12-14 Oct. 2009
Firstpage :
367
Lastpage :
370
Abstract :
Thin films, in the range of tens of micrometers thickness, have been prepared by casting onto glass plates the N-methylpyrrolidone solutions of two poly(ether imide)s containing isopropylidene or hexafluoroisopropylidene groups. The polymers have been synthesized by polycondensation reaction of 4,4´-(1,3-phenylenedioxy) dianiline, with 2,2-bis[(3,4-dicarboxyphenoxy) phenyl] propane dianhydride or 1,1,1,3,3,3-hexafluoro-2,2-bis [(3,4-dicarboxyphenoxy) phenyl]propane dianhydride. They were easily soluble in polar aprotic solvents and showed high thermal stability. The surface properties of the poly(ether imide) thin films such as dynamic contact angles, contact angle hysteresis, and water vapours sorption capacity were evaluated in correlation with their structure. The dielectric spectroscopy in the frequency range of 10-1-106 Hz and at temperature range from 100degC to 175degC was employed to study the electrical behaviour of polymer films.
Keywords :
casting; contact angle; dielectric losses; liquid phase deposition; permittivity; polymer films; polymerisation; solubility; sorption; thermal stability; thin films; 1,1,1,3,3,3-hexafluoro-2,2-bis [(3,4-dicarboxyphenoxy) phenyl]propane dianhydride; 2,2-bis[(3,4-dicarboxyphenoxy) phenyl] propane dianhydride; 4,4´-(1,3-phenylenedioxy) dianiline; N-methylpyrrolidone solutions; contact angle hysteresis; dielectric constant; dielectric loss; dielectric spectroscopy; dynamic contact angles; electrical behaviour; fluorine; frequency 1.0 Hz to 10000000 Hz; hexafluoroisopropylidene groups; polar aprotic solvents; poly(ether-imide) thin film synthesis; polycondensation reaction; polymer films; solubility; solution casting technique; surface property; temperature 100 C to 175 C; thermal stability; water vapour sorption capacity; Casting; Contacts; Dielectric thin films; Glass; Hysteresis; Polymer films; Solvents; Thermal stability; Transistors; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2009. CAS 2009. International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4244-4413-7
Type :
conf
DOI :
10.1109/SMICND.2009.5336705
Filename :
5336705
Link To Document :
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