Thin polyimide films for dielectric interlayer application

Thin films based on siloxane-containing polyimides have been prepared by the drop-casting technique. These films with thickness of tens of micrometers were flexible and resisted to repeated bendings. Very thin films having the thickness in the nanometer range, with neat surface, without pinholes or cracks, were obtained, as well. The mechanical and dielectric properties of these polyimide films were measured and discussed.