Thin polyimide films for dielectric interlayer application

Author

Damaceanu, Mariana-Dana ; Rusu, Radu-Dan ; BRUMA, Maria ; Müller, Alexandru

Author_Institution

Petru Poni Inst. of Macromolecular Chem., Iasi, Romania

Volume

2

fYear

2009

fDate

12-14 Oct. 2009

Firstpage

351

Lastpage

354

Abstract

Thin films based on siloxane-containing polyimides have been prepared by the drop-casting technique. These films with thickness of tens of micrometers were flexible and resisted to repeated bendings. Very thin films having the thickness in the nanometer range, with neat surface, without pinholes or cracks, were obtained, as well. The mechanical and dielectric properties of these polyimide films were measured and discussed.

Keywords

casting; dielectric losses; dielectric thin films; elastic constants; elastic moduli; electric breakdown; elongation; permittivity; polymer films; tensile testing; breakdown voltage; dielectric constant; dielectric interlayer application; dielectric loss; dielectric properties; drop-casting technique; elastic modulus; elongation; mechanical properties; stiffness; tensile strength; tensile testing; thin polyimide films; Dielectric constant; Dielectric films; Dielectric loss measurement; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectric thin films; Frequency; Polyimides; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2009. CAS 2009. International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-4413-7

Type

conf

DOI

10.1109/SMICND.2009.5336709

Filename

5336709