A multichip module integration technology for high-speed analog and digital applications

Author

Mangold, T. ; Wolf, J. ; Topper, M. ; Reich, H. ; Russer, P.

Author_Institution

Lehrstuhl fur Hochfrequenztech., Tech. Univ. Munchen, Germany

fYear

1998

fDate

29 Sep-2 Oct 1998

Firstpage

91

Lastpage

96

Abstract

We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid Pyralin^TM (2722 (Du Pont) and Cyclotene^TM (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W/Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction

Keywords

equivalent circuits; high-speed integrated circuits; integrated circuit technology; multichip modules; Cu; Cyclotene; MCM-D; Polyimid Pyralin; Ti:W/Cu tie layer; analog circuit; ceramic substrate; digital circuit; electromagnetic full-wave model; electroplated copper wiring; embedded system; equivalent circuit; high-speed circuit; interlevel dielectric; metallization; parameter extraction; planar multichip module integration technology; polymer film; silicon substrate; sputtered copper wiring; thin film multilayer; Copper; Dielectric substrates; Dielectric thin films; Electromagnetic modeling; Embedded system; Frequency; Multichip modules; Nonhomogeneous media; Polymer films; Sputtering;

fLanguage

English

Publisher

ieee

Conference_Titel

Signals, Systems, and Electronics, 1998. ISSSE 98. 1998 URSI International Symposium on

Conference_Location

Pisa

Print_ISBN

0-7803-4900-8

Type

conf

DOI

10.1109/ISSSE.1998.738045

Filename

738045