Research of microstructure and characteristics of aging treatment of Cu-20Ni-5Sn alloy

Author

Liu, Ruiqing ; Peng, Lijun ; Xiao, Xianpeng

Author_Institution

Nat. Res. Center of Copper Metall. & Metal-working Eng. & Technol., Eng. Inst. of Jiangxi Univ. Technol. & Sci., Ganzhou, China

fYear

2011

fDate

24-26 June 2011

Firstpage

3366

Lastpage

3369

Abstract

Study the effect of aging treatment on tensile strength, elongation and electrical conductivity of Cu-20Ni-5Sn alloy. Investigate the relationship between the second phases and microstructure of alloy which has good integrative feature. The results show that cold deformation is useful to obtain double strengthening effect of deformation and aging. The strength rises with the increase of aging temperature because the action of modulation resolution. The holding time which alloy achieves peak strength shortens with the increase of aging temperature. The electrical conductivity rises greatly with the increase of holding time when it is less than 2h, and enhances slightly when it is more than 2h. Aging treatment at 375°C×8h, alloy has good integrative feature, the tensile strength, elongation and electrical conductivity are 927MPa, 10%, 6.4IACS%respectively.

Keywords

ageing; copper alloys; deformation; electrical conductivity; elongation; modulation; nickel alloys; tin alloys; CuNiSn; aging treatment; cold deformation; double strengthening effect; electrical conductivity; elongation; modulation resolution; tensile strength; Aging; Conductivity; Materials; Microstructure; Nickel; Tin; Cu-20Ni-5Sn alloy; aging temperature; electrical conducticity; holding time; microstructure; sgtrength and elongation;

fLanguage

English

Publisher

ieee

Conference_Titel

Remote Sensing, Environment and Transportation Engineering (RSETE), 2011 International Conference on

Conference_Location

Nanjing

Print_ISBN

978-1-4244-9172-8

Type

conf

DOI

10.1109/RSETE.2011.5965034

Filename

5965034