• DocumentCode
    245461
  • Title

    Study on the Effect Mechanism of the Bipolar Junction Transistor Caused by ESD

  • Author

    Zhiliang Tan ; Peijiao Song ; Liyun Ma ; Zhaoxiang Meng

  • Author_Institution
    Inst. of Electrostatic & Electromagnetic Protection, Mech. Eng. Coll., Shijiazhuang, China
  • fYear
    2014
  • fDate
    19-21 Dec. 2014
  • Firstpage
    319
  • Lastpage
    323
  • Abstract
    In order to study the electrostatic discharge (ESD) electromagnetic pulse (EMP) to effect mechanism of bipolar junction transistors, systematic ESD injection experiments have been carried on high-frequency low-power transistors, such as 3DG81C, by using ESD model of the human body. Based on the software of Medici, the simulation model of bipolar transistor was established. Through simulation analysis, it is found that the most sensitive port of this kind of devices to ESD is CB junction. Through failure analysis of the devices, the electromagnetic damage mechanism of this kind of transistor is thermal damage which was caused by the thermal secondary breakdown, and the failure modes of transistor are electrical parameter drift, short circuit and functional failure.
  • Keywords
    bipolar transistors; electromagnetic pulse; electrostatic discharge; failure analysis; semiconductor device models; thermal engineering; 3DG81C; CB junction; EMP; Medici software; bipolar junction transistor; electrical parameter drift; electromagnetic damage mechanism; electromagnetic pulse; electrostatic discharge; failure analysis; high-frequency low-power transistor; short circuit; systematic ESD injection experiment; thermal damage; thermal secondary breakdown; Avalanche breakdown; Bipolar transistors; Electrostatic discharges; Junctions; Transistors; Voltage measurement; ESD; effect mechanism; failure analysis; senstive port; transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Science and Engineering (CSE), 2014 IEEE 17th International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-7980-6
  • Type

    conf

  • DOI
    10.1109/CSE.2014.86
  • Filename
    7023597