• DocumentCode
    2454737
  • Title

    Additive mobility enhancement and off-state current reduction in SiGe channel pMOSFETs with optimized Si Cap and high-k metal gate stacks

  • Author

    Oh, Jungwoo ; Majhi, Prashant ; Jammy, Raj ; Joe, Raymond ; Dip, Anthony ; Sugawara, Takuya ; Akasaka, Yasushi ; Kaitsuka, Takanobu ; Arikado, Tsunetoshi ; Tomoyasu, Masayuki

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    2009
  • fDate
    27-29 April 2009
  • Firstpage
    22
  • Lastpage
    23
  • Abstract
    We have demonstrated high mobility pMOSFETs on high quality epitaxial SiGe films selectively grown on Si (100) substrates. With a Si cap processed on SiGe channels, HfSiO2 high-k gate dielectrics exhibited low C-V hysteresis (<10 mV), interface trap density (7.5times1010), and gate leakage current (~10-2 A/cm2 at an EOT of 13.4 Aring), which are comparable to gate stack on Si channels. The mobility enhancement afforded intrinsically by the SiGe channel (60%) is further increased by a Si cap (40%) process, resulting in a combined ~100% enhancement over Si channels. The Si cap process also mitigates the low potential barrier issues of SiGe channels, which are major causes of the high off-state current of small bandgap energy SiGe pMOSFETs, by improving gate control over the channel.
  • Keywords
    Ge-Si alloys; MOSFET; hafnium compounds; high-k dielectric thin films; HfSiO2; SiGe; additive mobility enhancement and; channel pMOSFET; gate control improvement; high-k gate dielectrics; high-k metal gate stacks; off-state current reduction; Capacitance-voltage characteristics; Dielectric substrates; Germanium silicon alloys; High K dielectric materials; High-K gate dielectrics; Hysteresis; Leakage current; MOSFETs; Semiconductor films; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 2009. VLSI-TSA '09. International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-2784-0
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2009.5159274
  • Filename
    5159274