• DocumentCode
    2454986
  • Title

    Nanoelectromechanical systems for ultra-low-power computing and VLSI

  • Author

    Feng, Philip

  • Author_Institution
    Caltech, Pasadena, CA, USA
  • fYear
    2009
  • fDate
    27-29 April 2009
  • Firstpage
    47
  • Lastpage
    47
  • Abstract
    Nanoscale devices with mechanical degrees of freedom offer compelling characteristics that make them very attractive for mechanical and quantum logic devices. As we are able to create nanoelectromechanical systems (NEMS) with unprecedented feature sizes, advanced complexity and functionality, and high yield and control (at wafer-scale), they become increasingly interesting for low-power logic and memory, as well as become more meaningful for VLSI. Partly this is driven by NEMS devices´ unique merits such as exceptionally large on/off ratio, non-leakage, ultralow switching power, fast speed, and temperature insensitivity. In parallel, this is also an intriguing effort in the quest for the ultimately energy-efficient implementation of logic and computing. In this talk, I shall introduce the Caltech research effort towards these goals, including the recent demonstrations of several generic prototypes of nanoscale electromechanical switching devices, their characteristics and performance, progress on engineering such building blocks for NEMS-based logic and memory, all-mechanical and hybrid NEMS-CMOS, along with discussions and perspectives of technological promises and challenges.
  • Keywords
    VLSI; nanoelectromechanical devices; VLSI; nanoelectromechanical systems; ultra-low-power computing; Concurrent computing; Control systems; Energy efficiency; Logic devices; Nanoelectromechanical systems; Nanoscale devices; Quantum mechanics; Size control; Temperature; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 2009. VLSI-TSA '09. International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-2784-0
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2009.5159286
  • Filename
    5159286