DocumentCode :
2455418
Title :
High-κ/metal gate low power bulk technology - Performance evaluation of standard CMOS logic circuits, microprocessor critical path replicas, and SRAM for 45nm and beyond
Author :
Park, D.-G. ; Stein, K. ; Schruefer, K. ; Lee, Y. ; Han, J.-P. ; Li, W. ; Yin, H. ; Pacha, C. ; Kim, N. ; Ostermayr, M. ; Eller, M. ; Kim, S. ; Kim, K. ; Han, S. ; von Arnim, K. ; Moumen, N. ; Hatzistergos, M. ; Tang, T. ; Loesing, R. ; Chen, X. ; Jaeger,
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2009
fDate :
27-29 April 2009
Firstpage :
90
Lastpage :
92
Abstract :
This paper presents performance evaluation of high-kappa/metal gate (HK/MG) process on an industry standard 45 nm low power microprocessor built on bulk substrate. CMOS devices built with HK/MG demonstrate 50% improvement in NFET and 65% improvement in PFET drive current when compared with industry standard 45 nm Poly/SiON devices. No additional stress elements were used for this performance gain. The critical path circuits of this low power microprocessor built with HK/MG show dynamic performance gain over 50% at same supply voltage and 36% lower dynamic energy at same performance. Superior SRAM minimum operating voltage characteristics are achieved due to Vt variability reduction from HK/MG. Analog circuit functionality is demonstrated by a fully integrated PLL circuitry without any modification to process.
Keywords :
CMOS logic circuits; SRAM chips; field effect transistor circuits; low-power electronics; microprocessor chips; silicon compounds; NFET drive current; PFET drive current; SRAM chips; SiON; microprocessor critical path replicas; size 45 nm; standard CMOS logic circuits; Analog circuits; CMOS logic circuits; CMOS technology; Electricity supply industry; Metals industry; Microprocessors; Performance gain; Random access memory; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications, 2009. VLSI-TSA '09. International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-2784-0
Electronic_ISBN :
1524-766X
Type :
conf
DOI :
10.1109/VTSA.2009.5159305
Filename :
5159305
Link To Document :
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