An overview of integratable current sensor technologies

Author

Xiao, Chucheng ; Zhao, Lingyin ; Asada, Tadashi ; Odendaal, W.G. ; van Wyk, J.D.

Author_Institution

Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

Volume

2

fYear

2003

fDate

12-16 Oct. 2003

Firstpage

1251

Abstract

An overview is given of current sensing technologies that are suitable for packaging into integrated power electronics modules and integrated passive power processing units, such as integrated shunts and integratable Rogowski coils technologies. Technologies considered in this paper include: integrated current shunts, current transformers, Rogowski coils, Hall-effect current sensors, giant magneto resistive sensors (GMR) and magneto impedance sensors (MI). Each of these current sensing technologies is discussed separately along with their advantages, limitations and design trade-offs. Special emphasis is given to features that enhance or limit the technology´s potential for being integrated in the packaging process.

Keywords

coils; current transformers; electric current measurement; electric impedance measurement; electric sensing devices; giant magnetoresistance; magnetoresistive devices; packaging; Hall-effect current sensors; Rogowski coils; current sensing technologies; current transformers; giant magneto resistive sensors; integratable Rogowski coils technologies; integratable current sensor technologies; integrated current shunts; integrated passive power processing units; integrated power electronics modules; integrated shunts; magneto impedance sensors; packaging; packaging process; Coils; Costs; Current transformers; Electronics packaging; Magnetic sensors; Magnetic separation; Optical sensors; Power electronics; Sensor systems; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2003. 38th IAS Annual Meeting. Conference Record of the

Print_ISBN

0-7803-7883-0

Type

conf

DOI

10.1109/IAS.2003.1257710

Filename

1257710