Title :
Communication mechanisms for parallel DSP systems on a chip
Author :
Williams, Joseph ; Ackland, Bryan ; Heintze, Nevin
Author_Institution :
Circuits & Syst. Technol. Lab., Agere Syst., Holmdel, NJ, USA
Abstract :
We consider the implication of deep sub-micron VLSI technology on the design of communication frameworks for parallel DSP systems-on-chip. We assert that distributed data transfer and control mechanisms are necessary to manage many independent processing subsystems and software tasks. An example of a parallel DSP architecture is given and used to demonstrate these mechanisms at work. We show the similarity of these mechanism and those used in large scale computing networks
Keywords :
application specific integrated circuits; digital signal processing chips; integrated circuit design; parallel architectures; programmable circuits; VLSI circuit design; communication framework design; control mechanisms; deep sub-micron VLSI technology; distributed computing; distributed data transfer; large scale computing networks; packet switched I/O subsystem; parallel DSP architecture; parallel DSP systems-on-chip; processing subsystems; routing delays; software tasks; Communication system control; Delay; Digital signal processing; Digital signal processing chips; Distributed control; Integrated circuit interconnections; Multiprocessor interconnection networks; System-on-a-chip; Transistors; Very large scale integration;
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition, 2002. Proceedings
Conference_Location :
Paris
Print_ISBN :
0-7695-1471-5
DOI :
10.1109/DATE.2002.998308
